January 7, 2020 – Siemens Digital Industries Software announced a partnership with global semiconductor IP company Arm, that will bring IP, methodologies, processes and tools together to help automakers, integrators and suppliers collaborate, design and bring to market their next-generation platforms. This partnership was formed to address the challenges facing the industry in developing platforms to realize active-safety, advanced driver assistance, in-vehicle infotainment, digital cockpits, vehicle-to-vehicle/vehicle-to-infrastructure and self-driving vehicles. The combination of Siemens’ and Arm’s technologies is intended to help automakers and suppliers deliver electronic design and automotive solutions.
Siemens’ PAVE360 digital twin environment, featuring Arm IP, applies high-fidelity modeling techniques from sensors and ICs to vehicle dynamics and the environment within which a vehicle operates. Using Arm IP, including Arm Automotive Enhanced (AE) products with functional safety support, digital twin models can run entire software stacks providing early metrics of power and performance while operating in the context of a high-fidelity model of the vehicle and its environment.
Using Siemens’ PAVE360 with Arm automotive IP, automakers and suppliers can simulate and verify sub-system and system on chip (SoC) designs, and understand how they perform within a vehicle design from the silicon level up, long before the vehicle is built. Arm’s automotive IP is helping to democratize the ability to create safety-enabled silicon, bringing it within reach of the entire automotive supply chain. By rethinking IC design for the automotive industry, manufacturers can consolidate electronic control units (ECUs. This in turn reduces vehicle weight which can promote longer range electric vehicles.
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January 7, 2020 – Siemens Digital Industries Software announced a partnership with global semiconductor IP company Arm, that will bring IP, methodologies, processes and tools together to help automakers, integrators and suppliers collaborate, design and bring to market their next-generation platforms. This partnership was formed to address the challenges facing the industry in developing platforms to realize active-safety, advanced driver assistance, in-vehicle infotainment, digital cockpits, vehicle-to-vehicle/vehicle-to-infrastructure and self-driving vehicles. The combination of Siemens’ and Arm’s technologies is intended to help automakers and suppliers deliver electronic design and automotive solutions.
Siemens’ PAVE360 digital twin environment, featuring Arm IP, applies high-fidelity modeling techniques from sensors and ICs to vehicle dynamics and the environment within which a vehicle operates. Using Arm IP, including Arm Automotive Enhanced (AE) products with functional safety support, digital twin models can run entire software stacks providing early metrics of power and performance while operating in the context of a high-fidelity model of the vehicle and its environment.
Using Siemens’ PAVE360 with Arm automotive IP, automakers and suppliers can simulate and verify sub-system and system on chip (SoC) designs, and understand how they perform within a vehicle design from the silicon level up, long before the vehicle is built. Arm’s automotive IP is helping to democratize the ability to create safety-enabled silicon, bringing it within reach of the entire automotive supply chain. By rethinking IC design for the automotive industry, manufacturers can consolidate electronic control units (ECUs. This in turn reduces vehicle weight which can promote longer range electric vehicles.
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to read more great articles.
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